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PlasmaPro 100 Estrelas

The PlasmaPro 100 Estrelas platform is designed to give total flexibility for Deep Silicon Etch (DSiE) applications - serving a diverse set of process requirements across the Micro Electro Mechanical Systems (MEMS), Advanced Packaging and Nanotechnology markets. Developed with both the research and production markets in mind, the PlasmaPro 100 Estrelas offers the ultimate in process flexibility.

  • Smooth sidewall processes
  • High etch cavity etches
  • High aspect ratio processes
  • Tapered via etches
  • Wide range of applications
  • Mechanical or electrostatic clamping
  • Heated liners
  • Improved reproducibility
  • Increased mean time between cleans (MTBC)


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From smooth sidewall processes to high etch cavity etches and high aspect ratio processes to tapered via etches, the PlasmaPro 100 Estrelas has been designed to ensure that the wide range of applications in MEMS, advanced packaging and nanotechnology can be realised without the need to change chamber hardware.

Nano and micro structures can be realised as the hardware has been designed with the ability to run Bosch™ and Cryo etch technologies in the same chamber.

Compatible with 50mm to 200mm substrates - ensures you have the ability to develop devices that can be taken to production using the same chamber hardware

Auto match - Process flexibility

Higher flow MFCs and associated generators - High radical densities

Reduced chamber volume and high throughput pumping - Ensures high gas conductance

Fast-acting close coupled MFCs - Fast control (originally developed for ALD)

  • Silicon Bosch and cryo-etch processes
  • SiO2 and quartz etch
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Upgrades/Accessories

Gas pod - incorporate extra gas lines and allow greater flexibility

Logviewer software - datalogging software allows realtime graphing and post run analysis

Optical end point detectors - an important tool for achieving optimal process results

Soft pump - allows the slow pumping down of a vacuum chamber

Turbomolecular vacuum pump - offers superior pumping speeds and higher throughput

X20 Control System - delivers a future proof, flexible and reliable tool with increased system ‘intellect’

Advanced Energy Paramount generator - Offering increased reliability and greater plasma stability

Automatic pressure control - This controller ensures very fast and accurate pressure control

Dual CM gauge switching - provides the ability to utilise two differing ranges of capacitance manometer via a single pressure control valve

LN2 autochangeover unit - enables table cooling fluid to be automatically switched between Liquid Nitrogen (LN2) and Chiller Fluid

TEOS liquid level sensing - level sensing is achieved using ultra sonic level sensors fitted to the TEOS canister

Wide temperature range electrode - significant design improvements to increase process performance

Related Applications

EV TechnologiesAutomotive SensorsSolar and PV TechnologyFabricationBioMEMS Fabrication

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