Upgrades

Gas lines introduce greater flexibility, increasing the range of processes available for each process chamber.

Endpoint Detectors can help ensure your processes are carefully controlled and consistent, for reliable and repeatable results, wafer-after-wafer and batch-to-batch.

Electrodes designed to suit your specific system and process requirements, including pin, star and Esc wafer-lifting options, chiller temperature range, ambient to 400 ºC temperature range, and -150 ºC to 400 ºC temperature range.

The LN₂ Auto Changeover Unit (ACU) enables table cooling fluid to be automatically switched between Liquid Nitrogen (LN₂) and Chiller Fluid, via a recirculating chiller.

A soft pump upgrade allows the slow pumping-down of a vacuum chamber, with the aim of minimising the addition of particles on substrates which may be disturbed by rapid gas flows.

If you are planning to undertake a new process or increase the size of wafers processed, then we have a wide range of platens, carriers, and clamps available, including bespoke platens.

We aim to supply the latest generation of chillers, meaning your system benefits from leading-edge design innovations.

Electrostatic Chucks (ESCs) are widely used for clamping wafers by electrostatic charge as an alternative to traditional mechanical clamping methods.

The Dual CM Gauge Switching Upgrade helps improve your process by providing you with the ability to utilise two ranges of capacitance manometer via a single pressure control valve.

The Spacer Collar Upgrade for FlexAL platform reduces wafer particles, increases MTBC and reduces MTTC for faster chamber recovery, meaning more yield and productive system uptime.

This Reflectometer Upgrade benefits from dual functionality, with endpoint monitoring of film thickness during the process by capturing the optical emission and plasma chamber clean endpointing between processes.

The X20 PLC delivers a more future-proof, flexible and reliable tool with increased system intellect.

We aim to supply the latest generation of chamber backing pumps from leading manufacturers so that your system benefits from leading-edge design innovations.

We aim to supply the latest generation of loadlock and handler backing pumps, meaning your system benefits from the most recent leading-edge design improvements.

Upgrading your generators can provide increased reliability, greater plasma stability and improved matching speed.

Automatic Pressure Controllers ensure fast and accurate pressure control.

Where available, we aim to supply the latest generation of pumps, meaning your system benefits from leading-edge design innovations.

We aim to supply the latest generation of chillers, meaning your system benefits from leading-edge design innovations.

Electrodes designed to suit your specific system and process requirements, including pin, star and Esc wafer-lifting options, chiller temperature range, ambient to 400 ºC temperature range, and -150 ºC to 400 ºC temperature range.

Customers who have not already upgraded to a Windows 10 PC should take advantage of our simple upgrade path, involving a PC specification designed to account for future software upgrades.

The Vacuum Capacitator AMU (Automatic Matching Unit) is an upgrade for the now-obsolete Air Vane AMU.

PTIQ, our latest intelligent software solution for PlasmaPro, Plasmalab, and Atomfab processing equipment, provides an exceptional level of responsive system control, optimises system and process performance, and incorporates a user-friendly design.

'GEM' is a standard that builds upon a series of existing 'SECS' standards to define a means to coordinate/automate 'equipment' in a manufacturing (process) environment ('factory'), by means of a 'host'. These standards are colloquially referred to as 'SECS/GEM'.