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Process solutions for

Failure Analysis Applications (FA)

Industry-leading processes & systems for Failure Analysis dry etching de-processing

Yield management is a key factor in semiconductor manufacturing. To improve yield, one key technique is the de-processing of a failed chip or wafer to find and analyse the failure point in order to eliminate it. 

Featured Solutions

  • Isotropic polyimide removal (RIE or ICP mode)
  • Isotropic Nitride (passivation) removal (PE or ICP mode)
  • Anisotropic Oxide (IMD/ILD) removal (RIE or ICP mode)
  • Anisotropic Low-K Oxide removal (RIE or ICP mode)
  • Metal skeleton removal (RIE or ICP mode)
  • Poly-Si removal (RIE mode)
  • Al and Cu removal (ICP mode)
  • Backside Bulk Si removal (ICP mode)
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FA White Paper

In this white paper we present a suite of plasma processing tools for FA with the aim of providing practical guidance as to their suitability for different tasks.

FA white paper
Failure Analysis SEM 1
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Failure Analysis SEM 4

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For analysis or defect identification to be performed the device must be suitably prepared, this becomes more challenging as device architectures become ever more 3-dimensional. Plasma assisted etch and deposition are used to ensure accurate, quickly achieved results.

Oxford Instruments’ flexible Failure Analysis (FA) tools allow a wide range of processes, able to process small die or packaged devices through to 300mm wafers. Well controlled processing means that there is no damage to the metal conducting tracks.

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Failure Analysis products

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