Part of the Oxford Instruments Group
Process solutions for

Failure Analysis Applications (FA)

Industry-leading processes & systems for Failure Analysis dry etching de-processing

Yield management is a key factor in semiconductor manufacturing. To improve yield, one key technique is the de-processing of a failed chip or wafer to find and analyse the failure point in order to eliminate it. 

Featured Solutions

  • Isotropic polyimide removal (RIE or ICP mode)
  • Isotropic Nitride (passivation) removal (PE or ICP mode)
  • Anisotropic Oxide (IMD/ILD) removal (RIE or ICP mode)
  • Anisotropic Low-K Oxide removal (RIE or ICP mode)
  • Metal skeleton removal (RIE or ICP mode)
  • Poly-Si removal (RIE mode)
  • Al and Cu removal (ICP mode)
  • Backside Bulk Si removal (ICP mode)
Request More Information

FA White Paper

In this white paper we present a suite of plasma processing tools for FA with the aim of providing practical guidance as to their suitability for different tasks.

FA white paper
Failure Analysis SEM 1
Failure Analysis SEM 2
Failure Analysis SEM 3
Failure Analysis SEM 4

More Information

For analysis or defect identification to be performed the device must be suitably prepared, this becomes more challenging as device architectures become ever more 3-dimensional. Plasma assisted etch and deposition are used to ensure accurate, quickly achieved results.

Oxford Instruments’ flexible Failure Analysis (FA) tools allow a wide range of processes, able to process small die or packaged devices through to 300mm wafers. Well controlled processing means that there is no damage to the metal conducting tracks.

Download PlasmaPro 80 Brochure

Failure Analysis products

Related Content