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PlasmaPro 800 PECVD

The PlasmaPro 800 offers a flexible solution for reactive ion etching (RIE) processes on large wafer batches and 300mm wafers, in a compact footprint, open-loading system. The large wafer platen allows for production scale batch processing and 300mm wafer handling.

  • High performance processes
  • Excellent substrate temperature control
  • Precise process control
  • Proven processes for 300mm single wafer Failure Analysis
  • High performance processes
  • Excellent substrate temperature control
  • Precise process control


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The PlasmaPro 800 with a 460mm diameter table offers full 300mm or large batch 43 x 50mm (2”) capacity, enabling full production solutions and establishing the PlasmaPro 800 as a well proven market leading product.

Allowing maximum process flexibility for compound semiconductor, optoelectronics, and photonics applications, the PlasmaPro 800 provides:

Large electrode - Low Cost of Ownership

Etch end point detection - Reliability and serviceability

Endpoint detection by laser interferometry and/or optical emission spectroscopy - Can be fitted to enhance etch control

Options of a 4-, 8- or 12-line gas pod - Provides flexibility in processes and process gases, and may be remotely sited in the service area, away from the main process tool

Close-coupled turbo pump - High pumping speed and excellent base pressure

Datalogging - Traceability and history of chamber and process conditions

Fluid-cooled and/or electrically-heated electrodes - Excellent electrode temperature control and stability

  • Failure analysis dry etch de-processing using our specially configured failure analysis tools, with RIE and dual-mode
  • RIE/PE processes ranging from packaged chip and die etch through to full 300mm wafer etch
  • High quality PECVD of SiNx and SiO2 for photonics, dielectric layer passivation and many other applications
  • SiO2, SiNx and quartz etch
  • Metal and polyimide etch
  • Passivation deposition for high brightness LED production
  • III-V etch processes
Download PlasmaPro 800 brochure

Options

PlasmaPro 800 PECVD

  • Designed to produce high quality uniform dielectric films. Stress control in PECVD is provided by selectable or mixed high/low frequency plasma power, enabling deposited films to be tuned for tensile, compressive or low stress.

PlasmaPro 800 RIE/PE

  • Combines anisotropy of RIE with selectivity of PE mode etching in a single system.

PlasmaPro 800 RIE

  • Proven dry etching used widely throughout the industry.

Related Applications

Failure Analysis FabricationFabrication and Characterisation of Light Emitting DevicesBioMEMS Fabrication

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