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PlasmaPro 100 PECVD

The PECVD process modules are specifically designed to produce excellent uniformity and high rate films, with control of film properties such as refractive index, stress, electrical characteristics and wet chemical etch rate.

  • High quality films, high throughput, excellent uniformity

  • Wide temperature range electrode
  • Compatible with all wafer sizes up to 200mm
  • Rapid change between wafer sizes
  • Low cost of ownership and ease of serviceability
  • Resistive heated electrodes with capability up to 400°C or 1200°C
  • In-situ chamber cleaning and end-pointing

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Delivers reactive species to the substrate, with a uniform high conductance path through the chamber
Allows a high gas flow to be used while maintaining low pressure

Variable height electrode
Utilises the 3D characteristics of the plasma and accommodate substrates up to 10mm thick at optimum height

Wide temperature range electrode (-150°C to +400°C)
Can be cooled by liquid nitrogen, a fluid re-circulating chiller or resistively heated

A fluid controlled electrode fed by a re-circulating chiller unit Excellent substrate temperature control

RF powered showerhead with optimised gas delivery
Provides uniform plasma processing with LF/RF switching allowing precise control of film stress

ICP source sizes of 65mm, 180mm, 300mm
Delivers process uniformity up to 200mm wafers

High pumping capacity
Gives wide process pressure window

Wafer clamping with He backside cooling
Optimum wafer temperature control

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Global Customer Support

Oxford Instruments is committed to providing a comprehensive, flexible and reliable global customer support. We offer excellent quality service throughout the life of your system.

  • Remote diagnostics software provides quick and easy fault diagnosis and resolution.
  • Support contracts are available to suit the budget and situation.
  • Global spares in strategic locations for quick response.
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NEW: PTIQ Software

PTIQ is the latest intelligent software solution for PlasmaPro and Ionfab processing equipment.

  • Exceptional level of responsive system control
  • Optimise system and process performance
  • Different levels of software to suit your requirements
  • Brand new intuitive layout and design


Gas pod - incorporate extra gas lines and allow greater flexibility

Logviewer software - datalogging software allows realtime graphing and post run analysis

Optical end point detectors - an important tool for achieving optimal process results

Soft pump - allows the slow pumping down of a vacuum chamber

Turbomolecular vacuum pump - offers superior pumping speeds and higher throughput

X20 Control System - delivers a future proof, flexible and reliable tool with increased system ‘intellect’

Advanced Energy Paramount generator - Offering increased reliability and greater plasma stability

Automatic pressure control - This controller ensures very fast and accurate pressure control

Dual CM gauge switching - provides the ability to utilise two differing ranges of capacitance manometer via a single pressure control valve

LN2 autochangeover unit - enables table cooling fluid to be automatically switched between Liquid Nitrogen (LN2) and Chiller Fluid

TEOS liquid level sensing - level sensing is achieved using ultra sonic level sensors fitted to the TEOS canister

Wide temperature range electrode - significant design improvements to increase process performance

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