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PlasmaPro 100 Estrelas DSiE

The PlasmaPro 100 Estrelas platform is designed to give total flexibility for Deep Silicon Etch (DSiE) applications - serving a diverse set of process requirements across the Micro Electromechanical Systems (MEMS), Advanced Packaging and Nanotechnology markets. Developed for research and volume production, the PlasmaPro 100 Estrelas offers the ultimate flexibility with Bosch and Cryogenic processes.

  • High etches rate and high selectivity with Bosch process

  • Smooth sidewall & high aspect ratio processes

  • Highly anisotropic (vertical) profile

  • Low rate, low power for nano-silicon etch (thin SOI)

  • Tapered via etches
  • Wide range of applications
  • Mechanical or electrostatic clamping (substrates’ compatibility)

  • Improved reproducibility
  • Increased mean time between cleans (MTBC)


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DSiE technique or Deep Reactive Ion Etching (DRIE) combines isotropic silicon etching and passivation steps repeatedly to obtain anisotropic profiles. Using high density plasma source and fast gas-switching capability, this technique enables you to achieve profile verticality, smooth sidewalls and high etching rates with high selectivity to masking materials.

From smooth sidewall processes to high rate cavity etches and high aspect ratio processes to tapered via etches, the PlasmaPro 100 Estrelas has been designed to ensure that the wide range of applications in MEMS, advanced packaging and nanotechnology can be realised without the need to change chamber hardware.

Nano and microstructures can be realised as the hardware has been designed with the ability to run Bosch™ and Cryo etch technologies in the same chamber.

Bosch Process

Bosch deep Si etching

Compatible with 50mm to 200mm substrates - ensures you have the ability to develop devices that can be taken to production using the same chamber hardware

Auto match - Process flexibility

Higher flow MFCs and associated generators - High radical densities

Reduced chamber volume and high throughput pumping - Ensures high gas conductance

Fast-acting close-coupled MFCs - Fast control (originally developed for ALD)

Hardware Requirements

  • High density plasma (chemically-driven process)
  • Close-coupled gas pod
  • High flow and pumping
  • Fast switching
  • Advanced recipe editor
  • Heated liners and top plate
  • Efficient wafer cooling

Bosch Applications

Bosch DSiE is typically used for features >1µm and depths >10µm

  • MEMS for Smart Devices, Consumer & Industrial Electronics
  • Microfluids
  • Biomedical Devices​
  • Through Silicon Via (TSV)
  • SiO2 and Quartz Etch
  • High Q Capacitor Arrays and High Q Resonators for Quantum Devices

Bosch Process for High Q resonators
Microneedles with Bosch process

Cryogenic Applications

Cryogenic DSiE is typically used for smooth sidewalls and/or nano-etching and temperature sensitive materials, as it provides low temperature process (» -110°C)

  • Nano Applications
  • Photonics
  • Moulding

Cryo process micro-mould
Si waveguide with Cryogenic process
Parameter Bosch Cryogenic Mixed Gas
Rate (μm/min) High Moderate Low
Selectivity to PR Very High High Low
Profile Vertical Vertical or Sloped Vertical or Sloped
Aspect Ratio Very High High Low
Sidewalls Scallops Smooth Smooth
ARDE control Yes Limited Limited
Cleaning Infrequent Rare Regular
Min. feature /nm ≈ 300 ≈ 10 30
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Global Customer Support

Oxford Instruments is committed to providing a comprehensive, flexible and reliable global customer support. We offer excellent quality service throughout the life of your system.

  • Remote diagnostics software provides quick and easy fault diagnosis and resolution.
  • Support contracts are available to suit the budget and situation.
  • Global spares in strategic locations for quick response.
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PTIQ Software

PTIQ is the latest intelligent software solution for PlasmaPro and Ionfab processing equipment.

  • Exceptional level of responsive system control
  • Optimise system and process performance
  • Different levels of software to suit your requirements
  • Brand new intuitive layout and design
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Upgrades/Accessories

Gas pod - incorporate extra gas lines and allow greater flexibility

Logviewer software - datalogging software allows realtime graphing and post run analysis

Optical end point detectors - an important tool for achieving optimal process results

Soft pump - allows the slow pumping down of a vacuum chamber

Turbomolecular vacuum pump - offers superior pumping speeds and higher throughput

X20 Control System - delivers a future proof, flexible and reliable tool with increased system ‘intellect’

Advanced Energy Paramount generator - Offering increased reliability and greater plasma stability

Automatic pressure control - This controller ensures very fast and accurate pressure control

Dual CM gauge switching - provides the ability to utilise two differing ranges of capacitance manometer via a single pressure control valve

LN2 autochangeover unit - enables table cooling fluid to be automatically switched between Liquid Nitrogen (LN2) and Chiller Fluid

TEOS liquid level sensing - level sensing is achieved using ultra sonic level sensors fitted to the TEOS canister

Wide temperature range electrode - significant design improvements to increase process performance

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