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PlasmaPro 80 ICP RIE

The PlasmaPro 80 ICP RIE is a compact, small footprint system offering versatile ICP etch solutions with convenient open loading. It is easy to site and easy to use, with no compromise on process quality. The open load design allows fast wafer loading and unloading, ideal for research, prototyping and low-volume production. It enables high-performance processes using optimised electrode cooling and excellent substrate temperature control.

  • Open load design allows fast wafer loading and unloading
  • Excellent etch control and rate determination
  • Excellent wafer temperature uniformity
  • Up to 200mm wafers
  • Low cost of ownership
  • Built to Semi S2/S8 standards

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  • III-V etch processes
  • Silicon Bosch and cryo-etch processes
  • SiO2 and quartz etch
  • Failure analysis dry etch de-processing ranging from packaged chip and die etch through to full 200mm wafer etch
  • Hard mask deposition and etch for high brightness LED production
Top dielectric layer removed, exposing four metal layers

    Top dielectric layer removed, exposing four metal layers

    Top dielectric layer removed, exposing four metal layers

    Top dielectric layer removed, exposing four metal layers

    Low damage FA etching in the ICP65

    Low damage FA etching in the ICP65

    • Small footprint - Easy to site
    • Optimised electrode cooling - Substrate temperature control
    • High-conductance radial (axially symmetric) pumping configuration - Guaranteed enhanced process uniformity and rates are
    • Addition of < 500ms data logging - Traceability and history of chamber and process conditions
    • Close-coupled turbo pump - High pumping speed and excellent base pressure
    • Clear ease of access to key components - Improved serviceability and maintenance
    • X20 control system - Greatly increases data retrieval and delivers faster, more repeatable matching
    • Fault and tool diagnostics via front end software - Rapid fault diagnosis
    • Laser end-point detection using interferometry - Measure etch depth in transparent materials on reflective surfaces (for example, oxides on Si), or reflectometry for non-transparent materials (such as metals) to determine layer boundaries
    • Optical emission spectrometry (OES) for large sample or batch process end-pointing - Detecting changes in etch by-products or depletion of reactive gas species, and for chamber clean end-pointing

    Global Customer Support

    Oxford Instruments is committed to providing a comprehensive, flexible and reliable global customer support. We offer excellent quality service throughout the life of your system.

    • Remote diagnostics software provides quick and easy fault diagnosis and resolution.
    • Support contracts are available to suit the budget and situation.
    • Global spares in strategic locations for quick response.

    NEW: PTIQ Software

    PTIQ is the latest intelligent software solution for PlasmaPro and Ionfab processing equipment.

    • Exceptional level of responsive system control
    • Optimise system and process performance
    • Different levels of software to suit your requirements
    • Brand new intuitive layout and design

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