The PlasmaPro 80 reactive ion etch (RIE) is a compact, small footprint system offering versatile etch and deposition solutions with convenient open loading. It is easy to site and easy to use, with no compromise on process quality. The open load design allows fast wafer loading and unloading, ideal for research, prototyping and low-volume production. It enables high performance processes using optimised electrode cooling and excellent substrate temperature control.
RIE of InP waveguide
7 μm polyimide feature RIE
We had the privilege to speak with two Senior Research Fellows from UCL who use our PlasmaPro® 80 RIE system, presenting their latest research projects related to Quantum and Optoelectronic devices.
Dr Oscar Kennedy has used Plasma Pro RIE system to create superconducting circuit by etching the superconducting NbN film, whereas Dr Wing Ng has used the RIE system to accurately pattern a 50 nm gap with smooth sidewalls between a pair of waveguides for chip‑based optical buffers.
Reactive Ion Etching offers excellent process control in the fabrication of semiconductor devices and is used in many device manufacturing processes.
"With the PlasmaPro RIE, you can proceed with very aggressive chemical cleaning and then immediately deposit your superconductor on top of your substrate. It’s fast to use and straightforward with powerful and immediate results."
Dr Oscar Kennedy, UCLQ Postdoctoral Fellow
"Oxford’s RIE system offers high flexibility in the process and excellent control of the gases and the power of plasma."
Dr Wing Ng, Senior Research Fellow at UCL
Oxford Instruments is committed to providing a comprehensive, flexible and reliable global customer support. We offer excellent quality service throughout the life of your system.
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