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Ionfab Ion Beam

Our ion beam etch (IBE) & deposition (IBD) system is a popular choice for high-quality material processing. Our systems have flexible hardware options including open load, single substrate load lock and cassette to cassette. System specifications are closely tuned to applications, enabling faster and repeatable process results.

  • Multiple mode functionality

  • Capable of clustering with other plasma etch and deposition tools

  • Single wafer loadlock or cluster wafer handling

  • Dual-beam configuration

  • Very low surface film roughness

  • Unmatched batch uniformity and process reproducibility

  • Accurate end point detection – SIMS, optical emission

  • High-quality thin film for ultra-low contamination

  • High throughput with reduced footprint for low cost of operation

  • Patented high-speed substrated holder (up to 500 RPM)

  • Very accurate in-situ optical film control


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Ion beam technology provides an exceptionally versatile approach to etch and deposition by offering a single tool and maximising system utilisation. Ion beam etch offers maximum flexibility coupled with excellent uniformity.

Our systems have flexible hardware options including open load, single substrate load lock and cassette to cassette. System specifications are closely tuned to applications, enabling faster and repeatable process results.

Key Benefits

  • Flexible configuration for advanced research applications
  • Unmatched uniformity and process reproducibility for productio
  • Flexible wafer handling capacity - single wafer load lock or cassette-to-cassette robotic handler

Hardware Features

Wafer size 100 mm 200 mm
Etch RF ion source 15 cm 30 cm
Substrate rotation speed Up to 20 RPM
Substrate tilt angle -90° horizontal to +65° facing down
Platen temperature 10 °C to 300 °C chiller or heater configuration

Applications

  • Slanted etching
  • Laser facet etching
  • Magnetoresistive random access memory (MRAM)
  • Dielectric films
  • III-V photonics etching
  • Spintronics
  • Metal contact and track
  • Superconductors

 

Ion Beam Etching Modes

  • Ion Beam Etching (IBE) / Ion Beam Milling
  • Reactive Ion Beam Etching (RIBE)
  • Chemically Assisted Ion Beam Etching (CAIBE)

Need more information about Ionfab for IBE?

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Ion beam technology provides an exceptionally versatile approach to etch and deposition by offering a single tool and maximising system utilisation. Our ion beam deposition products are chosen for their ability to produce deposited films with high quality, dense and smooth surfaces.

Our systems have flexible hardware options including open load, single substrate load lock and cassette to cassette. System specifications are closely tuned to applications, enabling faster and repeatable process results.

Key Benefits

  • High-quality thin films with ultra-low contamination
  • High throughput with reduced footprint for lowest cost of operation
  • Unmatched batch uniformity and process reproducibility
  • Very accurate optical film thickness control
  • Very low surface film roughness

Hardware Features

Wafer size 100 mm 200 mm
Deposition ion source 15 cm 15 cm
Substrate rotation speed Up to 20 RPM
Substrate tilt angle -90° horizontal to +65° facing down
Platen temperature 10 °C to 300 °C chiller or heater configuration

Applications

  • Laser facet coating (including high and anti-reflection)
  • Ring laser gyroscope mirrors
  • X-ray optics
  • II-VI-based infrared (IR) sensors
  • IR sensors (Vanadium oxide, II-VI)
  • Telecom filters

 

Ion Beam Deposition Modes

  • Ion Beam Sputter Deposition (IBSD)
  • Ion-assisted Sputter Deposition (IASD)
  • Reactive Ion Beam Deposition (RIBD)

Need more information about Ionfab for IBD?

CONTACT US

Ionfab Standard Chamber

A compact ion beam etch and deposition system designed for flexible research and pilot production, equipped with up to two (15cm) ion sources for etch or deposition. This makes it ideal for deposition on up to 200 mm wafer size and etch process optimised for up to 100 mm wafer size.

Ionfab Large Chamber

Having essentially the same footprint but with a larger process chamber, it is designed to process wafers up to 200 mm for both etch and deposition. Equipped with a 30 cm etch ion source, the system provides excellent etch uniformity and superior process stability, making it a great choice for pilot and full scale production.

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Global Customer Support

Oxford Instruments is committed to providing a comprehensive, flexible and reliable global customer support. We offer excellent quality service throughout the life of your system.

  • Remote diagnostics software provides quick and easy fault diagnosis and resolution.
  • Support contracts are available to suit the budget and situation.
  • Global spares in strategic locations for quick response

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