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Semi interface spring 2026

Opto datacom edition

We’re excited to bring you Semi Interface Issue #5: Opto Datacom Edition, where we explore the innovations and collaborations shaping the future of technology. In this edition, we highlight the exciting breakthroughs that are advancing AI, AR wearables, silicon photonics, and more—pushing the boundaries of connectivity, data centres, and intelligent machines.

At Oxford Instruments, we are privileged to work alongside industry leaders and researchers to tackle some of the most complex challenges in semiconductor manufacturing. From our partnership with Coherent, which enabled the first fully automated 6-inch indium phosphide (InP) wafer technology, to our collaboration with Quantemol on tailored waveform biasing (TWB) for next-generation fabrication processes, we remain committed to enabling progress through innovation.

We also shine a spotlight on our new state-of-the-art technical training suite in Bristol, designed to empower our customers with the skills and knowledge to optimise system performance and operational efficiency. Join us as we share these stories and more, highlighting the people, technologies, and partnerships driving industry transformation.

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Editorial

Through the Looking Glass – The Future of AI and AR Wearables

Mixed reality (MR) and AI glasses are evolving rapidly, seamlessly blending physical and digital realities. However, challenges such as high costs, bulkiness, limited consumer appeal, and privacy concerns persist. Discover how Oxford Instruments is tackling these issues with advanced plasma processing solutions, including diffractive waveguide fabrication, microLED displays, and VCSEL technology.

 ICSCRM 2025

'The collaborative research also relies on advanced characterisation tools to evaluate and fine-tune the developed processes'


News

Oxford Instruments and Coherent Advance 6-Inch InP Wafer Technology

Oxford Instruments is supporting Coherent Corp. in achieving the first fully automated 6-inch indium phosphide (InP) wafer fabrication capability. The shift to 6-inch wafers enhances production capacity, reduces die costs, and supports AI data centres, telecommunications, and sensing technologies. This collaboration is paving the way for next-generation InP optoelectronic devices.

A panel discussion hosted at the British High Commission in Singapore

'...from basic R&D to targeted process and application development, Plasma Technology is ideally suited to be a partner for entrants embarking on this journey.'


Oxford Instruments and Quantemol Launch Plasma Modelling Collaboration

Oxford Instruments and Quantemol have partnered on an Innovate UK-backed project to advance plasma etching technology. By optimising ion energy control through tailored waveform biasing (TWB), the collaboration aims to reduce energy consumption, minimise waste, and enhance precision in semiconductor fabrication.

gallium nitride initiative aims to position Singapore as a global leader in semiconductor innovation

'Our goal in this project is to collaborate closely with A*STAR, local research institutions, and industry players to drive R&D efforts in GaN / SiC technology.'


Featured

Unlocking Capability – Inside Oxford Instruments’ New Technical Training Suite

Step into the future of technical training! Oxford Instruments has unveiled a state-of-the-art technical training suite in Bristol, UK, offering hands-on programmes in plasma etch, deposition, atomic layer etch (ALE), atomic layer deposition (ALD), and ion beam etch and deposition. With flexible delivery options, these courses empower customers to optimise system performance, minimise downtime, and enhance operational safety.

Atomic layer advantage Plasma ALD silicon nitride for GaN and SiC power devices

'Wide bandgap semiconductors like GaN and SiC are redefining the boundaries of power electronics'


Silicon Photonics – A New Era of Acceleration

Silicon photonics is emerging as a transformative technology for next-generation connectivity, driven by AI, hyperscale data centres, quantum computing, and medical imaging. The market for silicon photonics-based modules is projected to grow from $4.2 billion in 2024 to $24.8 billion by 2030 (35% CAGR). Explore how materials innovation, including SOI, SiN, LNOI, and InP platforms, is driving advancements in bandwidth, modulation, and coherent communication channels.


CIS at the Crossroads – Powering the Shift from Smartphones to Smart Machines

The CMOS Image Sensor (CIS) industry is evolving, with global revenues rebounding by 6.4% year-on-year in 2024. Automotive, security, and surveillance sectors are becoming key growth drivers, while emerging architectures like Digital Pixel Sensors (DPS) enable better sensitivity and adaptive sensing. Learn how CIS technology is powering the shift to intelligent, AI-enhanced smart machines.


Interviews

Lighting the Future – Prof. Peter Smowton

Join Prof. Peter Smowton as he discusses the pivotal role of compound semiconductors in revolutionising optoelectronics. From quantum dots and silicon integration to advancements in data centres, healthcare, and robotics, discover how cutting-edge research is bridging the gap between academia and industry to foster innovation and scalability.

SiC Power Devices

'SiC allows you to move the same amount of power with fewer losses, in a smaller, lighter, and often cooler system.'


SMART Photonics – Powering Europe’s Next Wave of Integrated Photonics

SMART Photonics is leading Europe’s photonics revolution with advanced indium phosphide (InP) photonic integrated circuits (PICs). Recent upgrades, including the move from 3-inch to 4-inch wafers, have doubled production capacity and reduced costs. Learn how collaborations with academia, industry, and government are accelerating developments in AI data centres, 5G/6G networks, LiDAR, and medical diagnostics.

Endpoint detection at Oxford Instruments

'So, we are happy to see customers gaining benefits from LayTec EtchpointTM. Oxford Instruments’ customer Rohm use it in their HVM process of p-GaN HEMTs, as well as other GaN PE and RF companies'


Insights

Tailored Waveform Biasing (TWB)

Tailored Waveform Biasing (TWB) is revolutionising semiconductor manufacturing by enabling precise ion energy control. Oxford Instruments and Quantemol are collaborating on an Innovate UK-supported project to explore TWB’s applications in next-generation fabrication processes like Atomic Layer Etching (ALE), with a focus on improving energy efficiency and minimising material waste.

SiC: Not a one trick power pony

'The adoption of SiC waveguides marks a significant optical breakthrough'


Strategic Enabler in Advanced Semiconductor Environments

Service excellence is the cornerstone of innovation. Oxford Instruments is redefining service with a proactive approach, emphasising preventive maintenance, technical training, and lifecycle support. Backed by a global team, the company is committed to delivering consistent, high-quality support to customers worldwide.