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PlasmaPro 100 ICPCVD

This ICPCVD process module is designed to produce high quality films at low growth temperatures, enabled through high-density remote plasmas that achieves superior film quality with low substrate damage.

  • Excellent uniformity, high throughput and high precision processes

  • High quality films
  • Wide temperature range electrode
  • Compatible with all wafer sizes up to 200mm
  • Rapid change between wafer sizes
  • Low cost of ownership and ease of serviceability
  • Compact footprint, flexible layout
  • Resistive heated electrodes with capability up to 400°C or 1200°C
  • In-situ chamber cleaning and end-pointing
  • Flexible vapour delivery module enabling deposition of films using liquid precursors  e.g. TiO2 using TTIP, SiO2 using TEOS

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  • Excellent quality low damage films at reduced temperatures.
  • Typical materials deposited include SiO2, Si3N4 and SiON, Si and SiC at substrate temperatures as low as 5ºC
  • ICP source sizes of 65mm, 180mm, 300mm delivering process uniformity
    up to 200mm wafers
  • Electrodes available for temperature ranges from 5ºC to 400ºC
  • Patented ICPCVD gas distribution technology
  • In situ chamber cleaning with endpointing
  • Flexible vapour delivery module enabling deposition of films using liquid precursors  e.g. TiO2 using TTIP, SiO2 using TEOS


Global Customer Support

Oxford Instruments is committed to providing a comprehensive, flexible and reliable global customer support. We offer excellent quality service throughout the life of your system.

  • Remote diagnostics software provides quick and easy fault diagnosis and resolution.
  • Support contracts are available to suit the budget and situation.
  • Global spares in strategic locations for quick response.

NEW: PTIQ Software

PTIQ is the latest intelligent software solution for PlasmaPro and Ionfab processing equipment.

  • Exceptional level of responsive system control
  • Optimise system and process performance
  • Different levels of software to suit your requirements
  • Brand new intuitive layout and design


  • Wall heating reduces chamber wall deposition
  • Helium backside cooling with mechanical clamping ensures uniform wafer temperatures & optimised film properties


Gas pod - incorporate extra gas lines and allow greater flexibility

Logviewer software - datalogging software allows realtime graphing and post run analysis

Optical end point detectors - an important tool for achieving optimal process results

Soft pump - allows the slow pumping down of a vacuum chamber

Turbomolecular vacuum pump - offers superior pumping speeds and higher throughput

X20 Control System - delivers a future proof, flexible and reliable tool with increased system ‘intellect’

Advanced Energy Paramount generator - Offering increased reliability and greater plasma stability

Automatic pressure control - This controller ensures very fast and accurate pressure control

Dual CM gauge switching - provides the ability to utilise two differing ranges of capacitance manometer via a single pressure control valve

LN2 autochangeover unit - enables table cooling fluid to be automatically switched between Liquid Nitrogen (LN2) and Chiller Fluid

TEOS liquid level sensing - level sensing is achieved using ultra sonic level sensors fitted to the TEOS canister

Wide temperature range electrode - significant design improvements to increase process performance

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