The PlasmaPro 800 offers a flexible solution for reactive ion etching (RIE) processes on large wafer batches and 300mm wafers, in a compact footprint, open-loading system. The large wafer platen allows for production scale batch processing and 300mm wafer handling.
The PlasmaPro 800 with a 460mm diameter table offers full 300mm or large batch 43 x 50mm (2”) capacity, enabling full production solutions and establishing the PlasmaPro 800 as a well proven market leading product.
Allowing maximum process flexibility for compound semiconductor, optoelectronics, and photonics applications, the PlasmaPro 800 provides:
Large electrode - Low Cost of Ownership
Etch end point detection - Reliability and serviceability
Endpoint detection by laser interferometry and/or optical emission spectroscopy - Can be fitted to enhance etch control
Options of a 4-, 8- or 12-line gas pod - Provides flexibility in processes and process gases, and may be remotely sited in the service area, away from the main process tool
Close-coupled turbo pump - High pumping speed and excellent base pressure
Datalogging - Traceability and history of chamber and process conditions
Fluid-cooled and/or electrically-heated electrodes - Excellent electrode temperature control and stability
Oxford Instruments is committed to providing a comprehensive, flexible and reliable global customer support. We offer excellent quality service throughout the life of your system.
PTIQ is the latest intelligent software solution for PlasmaPro and Ionfab processing equipment.
PlasmaPro 800 PECVD
PlasmaPro 800 RIE
Oxford Instruments launches Ionfab solution providing large area, high…
Oxford Instruments Supplies HLJ Technology Co. Ltd., with Plasma Etch and…
Oxford Instruments Plasma Technology (OIPT) has today launched a revolutionary…