VCSELs (Vertical-Cavity Surface-Emitting Lasers) are currently going through a wave of success with 3D sensing applications. Our VCSEL device manufacturing solutions support excellent electro-optical performance at maximum yield.DOWNLOAD BROCHURE
Pierrick Boulay (Yole) had the opportunity to interview Stéphanie Baclet, (Oxford Instruments), to discuss the challenges related to VCSEL manufacturing.READ THE INTERVIEW
VCSELs enable technologies such as 3D sensing, gesture recognition, and LIDAR for autonomous (self-driving) vehicles. Face recognition, powered by 3D sensing, has been adopted by several high-end smartphone manufacturers and opened a path for multiple new applications. These applications are now driving a shift from low-power to high-power operation for VCSELs.
VCSELs are used as an infra-red light emitter to illuminate the object to sense. They make ideal light sources for this application because of their unique device properties, including low beam divergence, temperature stability and low power consumption.
Note: simplified process flow.
At Oxford Instruments Plasma Technology, one of our great successes has been in mesa manufacturing for VCSELs. We have repeatedly demonstrated high precision manufacturing of VCSEL mesas from masking to etching of the mesa on 150mm wafers, with devices passing accelerated lifetime testing.
Mesas are etched uniformly and smoothly with extra-low footing. The process is assisted by fully automated endpoint detection which enables fine control on mesa height.
Our VCSEL solutions support excellent electro-optical performance at maximum yield. Using our strong expertise in plasma processing, we enable VCSEL manufacturers to produce high volumes of lasers at high quality. Our current solutions have been proven on substrates up to 150mm and is capable of processing 200mm substrate.
Our VCSEL solutions achieve excellent uniformity for maximum device performance.
Advanced plasma processing solutions can be achieved through our PlasmaPro 100 platform, which has been configured for high volume manufacturing up to 200mm wafer size.
Our CVD and ICP/RIE solutions include various steps such as masking, passivation, mesa or isolation. Oxford Instruments has a long history of working closely with the Compound Semiconductor community to deliver maximum device performance and manufacturing efficiency.
From high power conversion efficiency in 3D sensing to high stability in data communications, we accordingly support the manufacturing process to deliver target performances.