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Products


Product Groups (None selected)

ALD

  • Excellent process control
  • Superb thin film barrier properties
  • Virtually pin-hole free films

ALE

  • High selectivity
  • Low damage
  • Excellent uniformity

DSiE

  • Precision etch processes
  • High selectivity
  • High aspect ratio

IBD

  • Multiple wafer handling options
  • Multiple mode functionality
  • Single wafer loadlock or cluster wafer handling

IBE

  • Multiple wafer handling options
  • Multiple mode functionality
  • Single wafer loadlock or cluster wafer handling

ICP Etch

  • High density
  • Low pressure
  • Wide temperature range

ICPCVD

  • Excellent quality
  • Low damage films
  • Wide temperature range

Nanoscale Growth

  • Cold wall design with showerhead
  • Excellent temperature uniformity
  • Up to 1200oC

PECVD

  • Excellent uniformity
  • High rate films
  • Excellent control of film properties

RIE

  • Anisotropic dry etching
  • Fast and consistent etching
  • High pumping capacity
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