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PlasmaPro 100 ALE

As layers become thinner to enable the next generation semiconductor devices there is a need for ever more precise process control to create and manipulate these layers. The PlasmaPro 100 ALE delivers this through specialised hardware including:

  • Precise control of gas dose
  • Excellent repeatability of low power RF delivery
  • Rapid switching enabled by fast PLC

All these combine to enable etching with accuracy at the atomic scale.


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Our tools are well proven, with over 90% uptime and processes that are guaranteed to ensure rapid start-up during installation. The PlasmaPro 100 range supports a number of markets including but not limited to; MEMS & Sensors, Optoelectronics, Discrete Devices and Nanotechnology. It is flexible enough to be used in research and development, with the build quality to satisfy production needs.

PlasmaPro 100 ALE features:

  • Superb etch depth control
  •  Smooth etch surface
  •  Low damage process
  •  Digital/Cyclical etch process – Etch equivalent of ALD
  •  High selectivity
  •  Process capability upto 200mm wafers
  •  High aspect ratio (HAR) etch process
  •  Ideal for nanoscale layer etch removal
  • III-V etch processes
  • Solid State Lasers InP etch
  • VCSEL GaAs/AlGaAs etch
  • RF device low damage GaN etch
  • Silicon Bosch and cryo-etch processes
  • Diamond Like Carbon (DLC) deposition
  • SiO2 and quartz etch
  • Failure analysis dry etch de-processing using the specially-configured PlasmaPro FA tools ranging from packaged chip and die etch through to full 200mm wafer etch
  • High quality PECVD of silicon nitride and silicon dioxide for photonics, dielectric layers, passivation and many other uses
  • Hard mask deposition and etch for high brightness LED production
Download ALE brochure

Upgrades/Accessories

Gas pod - incorporate extra gas lines and allow greater flexibility

Logviewer software - datalogging software allows realtime graphing and post run analysis

Optical end point detectors - an important tool for achieving optimal process results

Soft pump - allows the slow pumping down of a vacuum chamber

Turbomolecular vacuum pump - offers superior pumping speeds and higher throughput

X20 Control System - delivers a future proof, flexible and reliable tool with increased system ‘intellect’

Advanced Energy Paramount generator - Offering increased reliability and greater plasma stability

Automatic pressure control - This controller ensures very fast and accurate pressure control

Dual CM gauge switching - provides the ability to utilise two differing ranges of capacitance manometer via a single pressure control valve

LN2 autochangeover unit - enables table cooling fluid to be automatically switched between Liquid Nitrogen (LN2) and Chiller Fluid

TEOS liquid level sensing - level sensing is achieved using ultra sonic level sensors fitted to the TEOS canister

Wide temperature range electrode - significant design improvements to increase process performance

Related Applications

Quantum Information ProcessingFabrication and Characterisation of Light Emitting DevicesBioMEMS Fabrication

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