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PlasmaPro 100 Cobra ICP RIE Etch

The PlasmaPro 100 Cobra ICP RIE Etch utilises high-density plasma to achieve fast etching and deposition rates. The process modules offer excellent uniformity, high-throughput, high-precision and low-damage processes for wafer sizes up to 200mm. 

Our systems have a wide install base within high volume manufacturing (HVM), with well-developed process solutions. The PlasmaPro 100 Cobra supports a number of markets including, MEMS & sensors, GaAs & InP laser optoelectronics, SiC & GaN power electronics, and RF.


  • Wide temperature range electrode, -150°C to 400°C

  • Compatible with all wafer sizes up to 200mm
  • Rapid change between wafer sizes
  • Low cost of ownership and ease of serviceability
  • Compact footprint, flexible layout
  • In-situ chamber cleaning and end-pointing

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The Cobra® ICP etching sources produce a high density of reactive species at low pressure. Substrate DC bias is independently controlled by an RF generator, allowing control of ion energy according to process requirements.

Oxford Instruments’ PlasmaPro 100 process modules offer a 200mm platform with single wafer and multi-wafer batch capability. The process modules offer excellent uniformity, high throughput and high precision processes.

Delivers reactive species to the substrate, with a uniform high conductance path through the chamber - Allows a high gas flow to be used while maintaining low pressure

Variable height electrode - Utilises the 3-dimensional characteristics of the plasma and accommodate substrates up to 10mm thick at optimum height

Wide temperature range electrode (-150°C to +400°C) which can be cooled by liquid nitrogen, a fluid re-circulating chiller or resistively heated - An optional blow out and fluid exchange unit can automate the process of switching modes

A fluid controlled electrode fed by a re-circulating chiller unit - Excellent substrate temperature control

RF powered showerhead with optimised gas delivery - Provides uniform plasma processing with LF/RF switching allowing precise control of film stress

ICP source sizes of 65mm, 180mm, 300mm - Delivers process uniformity up to 200mm wafers

High pumping capacity - Gives wide process pressure window

Wafer clamping with He backside cooling - Optimum wafer temperature control


Global Customer Support

Oxford Instruments is committed to providing a comprehensive, flexible and reliable global customer support. We offer excellent quality service throughout the life of your system.

  • Remote diagnostics software provides quick and easy fault diagnosis and resolution.
  • Support contracts are available to suit the budget and situation.
  • Global spares in strategic locations for quick response.

NEW: PTIQ Software

PTIQ is the latest intelligent software solution for PlasmaPro and Ionfab processing equipment.

  • Exceptional level of responsive system control
  • Optimise system and process performance
  • Different levels of software to suit your requirements
  • Brand new intuitive layout and design


Other PlasmaPro 100 Systems include:

PlasmaPro 100 RIE

  • The RIE modules deliver anisotropic dry etching for an extensive range of processes.

PlasmaPro 100 ICPCVD

  • The ICP CVD process module is designed to produce high quality films from room temperature to 400°C with high density plasmas at low deposition pressures and temperatures.

PlasmaPro 100 PECVD

  • The PECVD process modules are specifically designed to produce excellent uniformity and high rate films, with control of film properties such as refractive index, stress, electrical characteristics and wet chemical etch rate.


Gas pod - incorporate extra gas lines and allow greater flexibility

Logviewer software - datalogging software allows realtime graphing and post run analysis

Optical end point detectors - an important tool for achieving optimal process results

Soft pump - allows the slow pumping down of a vacuum chamber

Turbomolecular vacuum pump - offers superior pumping speeds and higher throughput

X20 Control System - delivers a future proof, flexible and reliable tool with increased system ‘intellect’

Advanced Energy Paramount generator - Offering increased reliability and greater plasma stability

Automatic pressure control - This controller ensures very fast and accurate pressure control

Dual CM gauge switching - provides the ability to utilise two differing ranges of capacitance manometer via a single pressure control valve

LN2 autochangeover unit - enables table cooling fluid to be automatically switched between Liquid Nitrogen (LN2) and Chiller Fluid

TEOS liquid level sensing - level sensing is achieved using ultra sonic level sensors fitted to the TEOS canister

Wide temperature range electrode - significant design improvements to increase process performance

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