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PlasmaPro 100 RIE

The PlasmaPro 100 RIE modules deliver anisotropic dry etching for an extensive range of processes.

  • Compatible with all wafer sizes up to 200mm
  • Rapid change between wafer sizes
  • Low cost of ownership and ease of serviceability
  • Excellent uniformity, high throughput and high precision processes

  • In-situ chamber cleaning and end-pointing
  • Wide temperature range electrode, -150°C to 400°C


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RIE of InP waveguide

RIE of InP waveguide

70nm Fused Silica lines 933nm deep Cr mask

70nm Fused Silica lines 933nm deep Cr mask

Dielectric metal etch

Dielectric metal etch

  • Delivers reactive species to the substrate, with a uniform high conductance path through the chamber
    Allows a high gas flow to be used while maintaining low pressure
  • Wide temperature range electrode (-150°C to +400°C)
    which can be cooled by liquid nitrogen, a fluid re-circulating chiller or resistively heated - An optional blow out and fluid exchange unit can automate the process of switching modes
  • A fluid controlled electrode fed by a re-circulating chiller unit
    Excellent substrate temperature control
  • High pumping capacity - gives wide process pressure window
  • Wafer clamping with He backside cooling
    Optimum wafer temperature control
Download PlasmaPro 100 brochure

Upgrades/Accessories

Dry pump N2 standby mode - Saves energy and nitrogen

Gas pod - incorporate extra gas lines and allow greater flexibility

Logviewer software - datalogging software allows realtime graphing and post run analysis

Optical end point detectors - an important tool for achieving optimal process results

Soft pump - allows the slow pumping down of a vacuum chamber

Turbomolecular vacuum pump - offers superior pumping speeds and higher throughput

X20 Control System - delivers a future proof, flexible and reliable tool with increased system ‘intellect’

Advanced Energy Paramount generator - Offering increased reliability and greater plasma stability

Automatic pressure control - This controller ensures very fast and accurate pressure control

Dual CM gauge switching - provides the ability to utilise two differing ranges of capacitance manometer via a single pressure control valve

LN2 autochangeover unit - enables table cooling fluid to be automatically switched between Liquid Nitrogen (LN2) and Chiller Fluid

TEOS liquid level sensing - level sensing is achieved using ultra sonic level sensors fitted to the TEOS canister

Wide temperature range electrode - significant design improvements to increase process performance

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