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PlasmaPro 100 RIE

The PlasmaPro 100 RIE modules deliver anisotropic dry etching for an extensive range of processes.

  • Compatible with all wafer sizes up to 200mm
  • Rapid change between wafer sizes
  • Low cost of ownership and ease of serviceability
  • Excellent uniformity, high throughput and high precision processes

  • In-situ chamber cleaning and end-pointing
  • Wide temperature range electrode, -150°C to 400°C

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  • Delivers reactive species to the substrate, with a uniform high conductance path through the chamber
    Allows a high gas flow to be used while maintaining low pressure
  • Wide temperature range electrode (-150°C to +400°C)
    which can be cooled by liquid nitrogen, a fluid re-circulating chiller or resistively heated - An optional blow out and fluid exchange unit can automate the process of switching modes
  • A fluid controlled electrode fed by a re-circulating chiller unit
    Excellent substrate temperature control
  • High pumping capacity - gives wide process pressure window
  • Wafer clamping with He backside cooling
    Optimum wafer temperature control
RIE of InP waveguide

RIE of InP waveguide

70nm Fused Silica lines 933nm deep Cr mask

70nm Fused Silica lines 933nm deep Cr mask - Courtesy of Cornell Nanoscience facility

Dielectric metal etch

Dielectric metal etch - Courtesy of Atmel


Global Customer Support

Oxford Instruments is committed to providing a comprehensive, flexible and reliable global customer support. We offer excellent quality service throughout the life of your system.

  • Remote diagnostics software provides quick and easy fault diagnosis and resolution.
  • Support contracts are available to suit the budget and situation.
  • Global spares in strategic locations for quick response.

NEW: PTIQ Software

PTIQ is the latest intelligent software solution for PlasmaPro and Ionfab processing equipment.

  • Exceptional level of responsive system control
  • Optimise system and process performance
  • Different levels of software to suit your requirements
  • Brand new intuitive layout and design


Gas pod - incorporate extra gas lines and allow greater flexibility

Logviewer software - datalogging software allows realtime graphing and post run analysis

Optical end point detectors - an important tool for achieving optimal process results

Soft pump - allows the slow pumping down of a vacuum chamber

Turbomolecular vacuum pump - offers superior pumping speeds and higher throughput

X20 Control System - delivers a future proof, flexible and reliable tool with increased system ‘intellect’

Advanced Energy Paramount generator - Offering increased reliability and greater plasma stability

Automatic pressure control - This controller ensures very fast and accurate pressure control

Dual CM gauge switching - provides the ability to utilise two differing ranges of capacitance manometer via a single pressure control valve

LN2 autochangeover unit - enables table cooling fluid to be automatically switched between Liquid Nitrogen (LN2) and Chiller Fluid

TEOS liquid level sensing - level sensing is achieved using ultra sonic level sensors fitted to the TEOS canister

Wide temperature range electrode - significant design improvements to increase process performance

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