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The PlasmaPro 100 Cobra ICP RIE system utilises a high-density inductively coupled plasma to achieve fast etch rates. The process modules offer excellent uniformity, high-throughput, high-precision and low-damage processes for wafer sizes up to 200mm, supporting a number of markets including, GaAs & InP laser optoelectronics, microLEDs & metalenses, SiC & GaN power electronics/RF and MEMS & sensors.
High etch rate and high selectivity
Low damage etch and high repeatability processing
Single wafer load lock or clusterable with up to 5 process modules
He backside cooling for optimum temperature control
Wide temperature range electrode, -150°C to 400°C
The Cobra® ICP plasma source produces high-density reactive species at low pressure. Substrate DC bias is driven by a separate RF generator, allowing independent control of radicals and ions, according to process requirements.
Oxford Instruments’ PlasmaPro 100 process modules offer a 200mm platform with single wafer and multi-wafer batch capability. The process modules offer high throughput, high precision and excellent uniformity with clean smooth vertical profiles and etch surfaces. Our systems have a wide install base within high volume manufacturing (HVM), with well-developed process solutions.
Wafer size: up to 200 mm
ICP source sizes available: 65mm and 300mm
Temperature range: From -150 up to 400 °C
Cluster with: up to 5 modules including technologies such as ALD, PECVD, Ion Beam Etch and Ion Beam Deposition
We had a highly informative conversation with two researchers from the University of Glasgow who have shared their innovative projects that take place at the state‑of‑the‑art James Watt Nanofabrication Centre (JWNC) cleanroom within the university.
Dr Jharna Paul and Valentino Seferai use the Oxford Instruments PlasmaPro® 100 Cobra ICP RIE system for the fabrication of superconducting qubits.
"We use Oxford Instruments PlasmaPro 100 Cobra ICP etching system, as you can effectively control the plasma, the power, the gas delivery, the chamber pressure and the substrate temperature." Dr Jharna Paul, Research Associate at the University of Glasgow
"With PlasmaPro 100 ICP Cobra, we get very smooth surfaces and sidewalls etched into the wafers and can also structure much deeper. Even the much harder aluminium nitrite that we need for UV LEDs can now be shaped."
Dr Jana Hartmann, Senior Research Group Leader at TU Braunschweig
"The ICP system effectively controls the etch rate and makes the process more stable."
Valentino Seferai, PhD Student, University of Glasgow
Oxford Instruments is committed to providing a comprehensive, flexible and reliable global customer support. We offer excellent quality service throughout the life of your system.
PTIQ is the latest intelligent software solution for PlasmaPro and Ionfab processing equipment.
Gas pod - incorporate extra gas lines and allow greater flexibility
Logviewer software - datalogging software allows realtime graphing and post run analysis
Optical end point detectors - an important tool for achieving optimal process results
Soft pump - allows the slow pumping down of a vacuum chamber
Turbomolecular vacuum pump - offers superior pumping speeds and higher throughput
X20 Control System - delivers a future proof, flexible and reliable tool with increased system ‘intellect’
Advanced Energy Paramount generator - Offering increased reliability and greater plasma stability
Automatic pressure control - This controller ensures very fast and accurate pressure control
Dual CM gauge switching - provides the ability to utilise two differing ranges of capacitance manometer via a single pressure control valve
LN2 autochangeover unit - enables table cooling fluid to be automatically switched between Liquid Nitrogen (LN2) and Chiller Fluid
TEOS liquid level sensing - level sensing is achieved using ultra sonic level sensors fitted to the TEOS canister
Wide temperature range electrode - significant design improvements to increase process performance
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