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MKS Vision 2000C RGA

Unlock enhanced process control with the MKS Vision 2000-C RGA now available on our PlasmaPro ASP platform 

Real-time residual gas analysis for in-situ monitoring of chamber chemistry.  


Overview 

Improve process insight, reduce downtime, and maintain tighter process control with continuous visibility into chamber chemistry. The MKS Vision 2000-C RGA delivers real-time monitoring of process gases throughout the process cycle, helping identify issues faster, thereby reducing process instability risk.

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Why the MKS Vision 2000-C RGA? 

Combining advanced mass spectrometry with automated process monitoring, the MKS Vision 2000-C RGA operates across a 1–300 amu mass range to detect process gases, reaction by-products, contaminants, and leaks with exceptional precision. 

Key benefits

Applications


Ideal for semiconductor manufacturers seeking deeper process insight across multiple plasma processes, from R&D environments to high-volume production.

Talk to a regional service sales specialist today and discover how real-time residual gas analysis can improve process insight, accelerate troubleshooting, and optimise process performance.

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NEW: PTIQ software

PTIQ is the latest intelligent software solution for PlasmaPro and Ionfab processing equipment.

  • Exceptional level of responsive system control
  • Optimise system and process performance
  • Different levels of software to suit your requirements
  • Brand new intuitive layout and design
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Global customer support

Oxford Instruments is committed to providing a comprehensive, flexible and reliable global customer support. We offer excellent quality service throughout the life of your system.

  • Remote diagnostics software provides quick and easy fault diagnosis and resolution.
  • Support contracts are available to suit the budget and situation.
  • Global spares in strategic locations for quick response.
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Explore our comprehensive technical training courses

At Oxford Instruments Plasma Technology, we offer a wide range of technical training courses designed to suit all skill levels and needs.

  • Level 1 (Introductory): New system users for all platforms
  • Level 2 (Intermediate): Equipment and maintenance training for all platforms
  • Level 3 (Advanced): for plasma etch and deposition, ion beam and PEALD systems
  • Specialist technical modules: process and handler technical training for all platforms
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