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Diamond offers a set of characteristics that make it an interesting choice for a wide range of applications. It has the highest known thermal conductivity making it attractive for heat removal, is chemically un-reactive and is the hardest known material. It also has a wide (5.5eV) indirect bandgap meaning it has a high breakdown voltage. It can be etched using Inductively Coupled Plasma (ICP), Reactive Ion Etching (RIE) or Ion Beam Etch (IBE).
Good control of surface morphology.
Process achieves anistropic profile and smooth surfaces .