We offer several solutions for superconducting qubits & quantum circuits:
We've developed a plasma ALD process of NbN for higher temperature operation of superconducting interconnects
We've successfully deposited superconducting TiN by plasma ALD using bias to finely tune the film properties such as room temperature resistivity. Consequently, this has achieved a critical temperature of 3 K for a 90 nm film deposited at 250°C
(Credit: University of Glasgow)
Combine the benefits of plasma ALD (PE-ALD) with the capability of clustering systems to other technologies and unlock unique capabilities.
Remove amorphous native oxide prior to growing high-quality PE-ALD of Al2O3 by either:
(Credit: Jinesh et al., 2011)
Single-layer or stack etch resulting in:
200 nm Nb etch
Resist mask fully stripped
200 nm Mo etch
Resist mask partly stripped
Vertical Al/Al2O3/Al tunnel junction stack etch
We offer two etch processes to fabricate vertical TSVs, thereby enabling scaling of superconducting quantum circuits based on a 3D architecture
Bosch etch for TSV
Cryo etch for ultra smooth sidewall features
Enabling these solutions are the FlexAL and PlasmaPro 100 deposition and etch systems, capable of producing small coupons through to 200 mm wafers, clusterable to increase throughput and avoid vacuum breaks.
Our PlasmaPro 100 platform enables high precision deposition and etching of a wide range of materials for quantum devices.
The FlexAL atomic layer deposition (ALD) system offers a broad range of optimised high-quality ALD processes for the fabrication of tunnel barriers and passivation layers for a variety of quantum devices, and enables the deposition of superconducting thin films with high critical temperature for TSVs, resonators and single-photon detectors.
Oxford Instruments have a strong history in providing state of the art solutions in this rapidly developing applications are a key enabler of quantum technologies beyond device fabrication solutions.