Leading Quantum Technology Solutions for Next-Gen Applications

We offer several solutions for superconducting qubits & quantum circuits:

• ALD of superconducting nitrides, e.g. NbN, TiN
• ALD of tunnel barriers, e.g. Al₂O₃, AlN
• Plasma etching of superconducting metals and nitrides
• Deep silicon etch for Through-Silicon Via (TSV) for 3D integration

Behind our solutions and expertise is years of research in deposition and etch for the fabrication of components for superconducting quantum circuits.

We offer three key applications for photonic integrated circuits for quantum:

• Atomic layer deposition of superconducting nitrides for SNSPDs
• High temperature, SiH₄ and NH₃-free PE (ICP) CVD of Si₃N₄ for low-loss waveguides
• Plasma etching for optical components (e.g. gratings, waveguides)

Enabling these solutions are the FlexAL and PlasmaPro 100 deposition and etch systems, capable of producing small coupons through to 200 mm wafers, clusterable to increase throughput and avoid vacuum breaks. Our PlasmaPro 100 platform enables high precision deposition and etching of a wide range of materials for quantum devices.

We offer key processing solutions for various device fabrication challenges for the various approaches in today’s quantum technology R&D and device development.

Oxford Instruments have a strong history in providing state of the art solutions in this rapidly developing applications are a key enabler of quantum technologies beyond device fabrication solutions.