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FlexAL

The FlexAL systems provide a new range of flexibility and capability in the engineering of nanoscale structures and devices by offering remote plasma atomic layer deposition (ALD) processes and thermal ALD within a single ALD system.

  • Remote plasma & thermal ALD in one flexible tool
  • Clusterable for vacuum transfer of substrates
  • Cassette to cassette handling increases throughput suitable for production
  • Maximum flexibility in the choice of materials & precursors
  • Low-temperature processes enabled by plasma ALD
  • Low damage maintained by the use of remote plasma
  • Controllable, repeatable processes via recipe-driven software interface
  • Ability to handle up to 200mm wafer


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The ALD product family encompasses a range of tools to meet the varied demands of academia, corporate R&D and small scale production.

Oxford Instruments has an extensive process library, and new processes are continually being developed. We provide free on-going process support for the lifetime of any ALD tool, offering advice on developing new materials and continued access to our latest ALD process developments including new process recipes.

Integral glove box on precursor modules - In-situ change-over

Integral ports - Allow the addition of in-situ ellipsometry measurement tools

Clusterable - Vacuum transfer of substrates

Cassette to cassette handling - Increases throughput suitable for production

Robotic handler and cassette - Handles 100mm, 150mm or 200mm wafers (no tools required to swap between wafers)

All configurations can be located entirely within the cleanroom or through-the-wall - Easy to site

Automated 200mm load lock - Process flexibility

  • Nano-electronics
  • High-k gate oxides
  • Storage capacitor dielectrics
  • High aspect ratio diffusion barriers for Cu interconnects
  • Pinhole-free passivation layers for OLEDs and polymers
  • Passivation of crystal silicon solar cells
  • Highly conformal coatings for microfluidic and MEMS applications
  • Coating of nanoporous structures
  • Bio MEMS
  • Fuel cells
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Options

FlexAL2D

The FlexAL2D system provides ALD of 2D transition metal dichalcogenides (TMDCs) for nanodevice applications and offers a number of benefits for growth of 2D materials

2D materials growth

  • At CMOS compatible temperatures
  • With precise digital thickness control
  • Over a large area (200mm wafers)

Robust ALD processes for 2D materials

  • Self-limiting ALD growth.
  • MoS2
  • Oxygen and carbon free (<2%)
  • High growth per cycle ~0.1 nm/cycle
  • Crystalline material above 300°C

Tunable morphology

  • Control over basal plane or edge plane orientation
  • Growth of ALD dielectrics & other ALD layers on 2D materials in one tool
  • Create advanced 2D device structures
  • RF substrate biasing option for film property control

Upgrades/Accessories

Gas pod - incorporate extra gas lines and allow greater flexibility

Logviewer software - datalogging software allows realtime graphing and post run analysis

Optical end point detectors - an important tool for achieving optimal process results

Turbomolecular vacuum pump - offers superior pumping speeds and higher throughput

X20 Control System - delivers a future proof, flexible and reliable tool with increased system ‘intellect’

Dual CM gauge switching - provides the ability to utilise two differing ranges of capacitance manometer via a single pressure control valve

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Nanomaterial Growth and CharacterisationSolar and PV TechnologyFabricationQuantum Information ProcessingFabrication and Characterisation of Light Emitting DevicesBioMEMS Fabrication

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