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FlexAL ALD

The FlexAL atomic layer deposition (ALD) system offers a broad range of optimised high-quality plasma ALD and thermal ALD processes with maximum flexibility in precursors, processes gases, and hardware configuration within a single process chamber.

  • Remote plasma for low damage plasma ALD combined with thermal ALD in one deposition chamber

  • RF biased electrode option available for control of film properties

  • Industry-standard cassette to cassette handling for higher throughput

  • Maximum flexibility in the choice of precursors, process gases, hardware features and options

  • Optimised to maintain low-damage, high-quality substrates

  • Low temperature to enable high-quality deposition on temperature-sensitive surfaces


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The ALD product family encompasses a range of tools to meet the varied demands of academia, corporate R&D and small scale production.

Oxford Instruments has an extensive process library, and new processes are continually being developed. We provide free on-going process support for the lifetime of any ALD tool, offering advice on developing new materials and continued access to our latest ALD process developments including new process recipes.

  • Chamber ports/windows for the integration of in-situ analysis equipment, e.g. ellipsometry
  • Automated single-wafer load-lock for loading of substrates up to 200 mm
  • Clusterable with additional process modules with vacuum transfer between chambers
  • Cleanroom interface available for through-wall installation
  • Ozone generator available for integration
  • Wide range of electrode options – grounded and biased electrodes
  • 300W or 600W plasma source generators
  • Superconducting nitrides for quantum devices
  • GaN HEMT pre-treatment and passivation
  • High quality high-k gate oxides for graphene passivation
  • ALD of 2D transition metal dichalcogenides (TMDCs)
  • Pinhole-free passivation layers for OLEDs and polymers
  • Passivation of crystalline silicon solar cells
  • ALD moisture barriers and passivation of sensitive substrates
  • Highly conformal coatings for microfluidic devices

Image Source (at the right):

Conformal deposition of SiO2, TiO2 and Al2O3 by Plasma ALD(CC BY 4.0 license), image library at www.AtomicLimits.com, 2021

Conformal deposition of SiO2, TiO2 and Al2O3 by Plasma ALD
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Global Customer Support

Oxford Instruments is committed to providing a comprehensive, flexible and reliable global customer support. We offer excellent quality service throughout the life of your system.

  • Remote diagnostics software provides quick and easy fault diagnosis and resolution.
  • Support contracts are available to suit the budget and situation.
  • Global spares in strategic locations for quick response.
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Options

FlexAL2D

The FlexAL2D system provides ALD of 2D transition metal dichalcogenides (TMDCs) for nanodevice applications and offers a number of benefits for growth of 2D materials

2D Materials Growth

  • At CMOS compatible temperatures
  • With precise digital thickness control
  • Over a large area (200mm wafers)

Robust ALD Processes for 2D Materials

  • Self-limiting ALD growth.
  • MoS2
  • Oxygen- and carbon-free (< 2%)
  • High growth per cycle ~0.1 nm/cycle
  • Crystalline material above 300°C

Tunable Morphology

  • Control over basal plane or edge plane orientation
  • Growth of ALD dielectrics & other ALD layers on 2D materials in one tool
  • Create advanced 2D device structures
  • RF substrate biasing option for film property control

Upgrades/Accessories

Gas pod - incorporate extra gas lines and allow greater flexibility

Logviewer software - datalogging software allows realtime graphing and post run analysis

Optical end point detectors - an important tool for achieving optimal process results

X20 Control System - delivers a future proof, flexible and reliable tool with increased system ‘intellect’

Dual CM gauge switching - provides the ability to utilise two differing ranges of capacitance manometer via a single pressure control valve

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