Next Generation Datacomms with Ultrafast Photonics Devices
Researchers at AMO GmbH have used Oxford Instruments Plasma Technology’s…
A compact ion beam etch and deposition system designed for flexible research and pilot production, equipped with up to two (15cm) ion sources for etch or deposition. This makes it ideal for deposition on up to 200mm wafer size and etch process optimised for up to 100mm wafer size.
Having essentially the same footprint but with a larger process chamber, it is designed to process wafers up to 200mm for both etch and deposition. Equipped with a 30cm etch ion source, the system provides excellent etch uniformity and superior process stability, making it a great choice for pilot and full scale production.