The PlasmaPro 800 offers a flexible solution for reactive ion etching (RIE) processes on large wafer batches and 300mm wafers, in a compact footprint, open-loading system. The large wafer platen allows for production scale batch processing and 300mm wafer handling.
The PlasmaPro 800 with a 460mm diameter table offers full 300mm or large batch 43 x 50mm (2”) capacity, enabling full production solutions and establishing the PlasmaPro 800 as a well proven market leading product.
Allowing maximum process flexibility for compound semiconductor, optoelectronics, and photonics applications, the PlasmaPro 800 provides:
Large electrode - Low Cost of Ownership
Etch end point detection - Reliability and serviceability
Endpoint detection by laser interferometry and/or optical emission spectroscopy - Can be fitted to enhance etch control
Options of a 4-, 8- or 12-line gas pod - Provides flexibility in processes and process gases, and may be remotely sited in the service area, away from the main process tool
Close-coupled turbo pump - High pumping speed and excellent base pressure
Datalogging - Traceability and history of chamber and process conditions
Fluid-cooled and/or electrically-heated electrodes - Excellent electrode temperature control and stability
Oxford Instruments is committed to providing a comprehensive, flexible and reliable global customer support. We offer excellent quality service throughout the life of your system.
PlasmaPro 800 PECVD
PlasmaPro 800 RIE/PE
PlasmaPro 800 RIE
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