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Part of the Oxford Instruments Group
Ion beam technology provides an exceptionally versatile approach to etch and deposition by offering a single tool and maximising system utilisation.
Superior process repeatability and low cost of ownership make the Ionfab tool an excellent system that is configurable from R&D to batch production.
| Ion Etching Source | 150mm or 300mm for up to 4" and 8" respectively |
| Etching Area | Up to 200mm diameter or 150mm square |
| Platen Speed | Up to 20rpm |
| Platen Tilt Angle | 0º to 75º between beam and normal to substrate surface |
| Platen Heat | Embedded heaters up to 300ºC with PID controln |
| Platen Cooling | Fluid coolant 5ºC to 60ºC with He or Ar backside gas for substrate cooling (up to 50Torr) |
High vacuum operation allows Ion Beam Deposition to deliver thin films with high quality and excellent electrical and optical properties.
| Ion deposition source | 150mm |
| Deposited area | Up to 200mm |
| Substrate rotation speed | Up to 20 RPM |
| Number of targets | Up to 4 targets |
| Platen size | Up to 8 inch wafer |
| Platen rotation | Up to 500rpm |
| Platen tilt angle | 0º to 75º between beam and normal to substrate surface |
We have many years of expertise in etching the slanted feature on large areas. Our solutions are designed to deliver the manufacturing quality required for surface-relief gratings.
Our solution delivers market-leading uniformity for wafer sizes up to 200mm.
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Oxford Instruments is committed to providing a comprehensive, flexible and reliable global customer support. We offer excellent quality service throughout the life of your system.
Speak to our experts or request pricing information today.
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