Ion beam technology provides an exceptionally versatile approach to etch and deposition by offering a single tool and maximising system utilisation.
Superior process repeatability and low cost of ownership make the Ionfab tool an excellent system that is configurable from R&D to batch production.
|Ion Etching Source||150mm or 300mm for up to 4" and 8" respectively|
|Etching Area||Up to 200mm diameter or 150mm square|
|Platen Speed||Up to 20rpm|
|Platen Tilt Angle||0º to 75º between beam and normal to substrate surface|
|Platen Heat||Embedded heaters up to 300ºC with PID controln|
|Platen Cooling||Fluid coolant 5ºC to 60ºC with He or Ar backside gas for substrate cooling (up to 50Torr)|
High vacuum operation allows Ion Beam Deposition to deliver thin films with high quality and excellent electrical and optical properties.
|Ion deposition source||150mm|
|Deposited area||Up to 200mm|
|Substrate rotation speed||Up to 20 RPM|
|Number of targets||Up to 4 targets|
|Platen size||Up to 8 inch wafer|
|Platen rotation||Up to 500rpm|
|Platen tilt angle||0º to 75º between beam and normal to substrate surface|
We have many years of expertise in etching the slanted feature on large areas. Our solutions are designed to deliver the manufacturing quality required for surface-relief gratings.
Our solution delivers market-leading uniformity for wafer sizes up to 200mm.DISCOVER OUR AR SOLUTIONS >
Oxford Instruments is committed to providing a comprehensive, flexible and reliable global customer support. We offer excellent quality service throughout the life of your system.
Speak to our experts or request pricing information today.