BioMEMS Fabrication

The PECVD process modules are specifically designed to produce excellent uniformity and high rate films, with control of film properties such as refractive index, stress, electrical…

The PlasmaPro 100 Cobra ICP utilises high-density plasma to achieve fast etching and deposition rates. The process modules offer excellent uniformity, high-throughput, high-precision…

The PlasmaPro 80 is a compact, small footprint system offering versatile etch and deposition solutions with convenient open loading. It is easy to site and easy to use, with no compromise…

The PlasmaPro 80 ICP is a compact, small footprint system offering versatile ICP etch solutions with convenient open loading. It is easy to site and easy to use, with no compromise…

The PlasmaPro 100 RIE modules deliver anisotropic dry etching for an extensive range of processes.

The PlasmaPro 80 reactive ion etch (RIE) is a compact, small footprint system offering versatile etch and deposition solutions with convenient open loading. It is easy to site and…

The PlasmaPro 800 offers a flexible solution for Plasma Enhanced Chemical Vapour Deposition (PECVD) processes on large wafer batches and 300mm wafers, in a compact footprint, open-loading…

The PlasmaPro 100 Estrelas platform is designed to give total flexibility for Deep Silicon Etch (DSiE) applications - serving a diverse set of process requirements across the Micro…

CVD/PECVD tools for growth of 1D/2D nanomaterials and heterostructures. The Nanofab delivers high performance growth of nanomaterials with in-situ catalyst activation and rigorous…

The PlasmaPro 80 is a compact, small footprint system offering versatile etch and deposition solutions with convenient open loading. It is easy to site and easy to use, with no compromise…

Atomfab delivers fast, low damage, low COO production plasma ALD processing for GaN power and RF devices.

This ICPCVD process module is designed to produce high quality films at low growth temperatures, enabled through high-density remote plasmas that achieves superior film quality with…

As layers become thinner to enable the next generation semiconductor devices there is a need for ever more precise process control to create and manipulate these layers. The PlasmaPro…

An evolution in single wafer etch technology

With extensive experience of etching materials such as GaN, SiC and Sapphire, our technologies enable the…

Maximised large area etching and deposition production solutions

The FlexAL systems provide a new range of flexibility and capability in the engineering of nanoscale structures and devices by offering remote plasma atomic layer deposition (ALD)…

The PlasmaPro 800 offers a flexible solution for reactive ion etching (RIE) processes on large wafer batches and 300mm wafers, in a compact footprint, open-loading system. The large…