Atomic Layer Etching
A new technique for ultra precise and low damage etching

SiC Power Devices
Achieving smooth, low defect density substrates and optimum UMOSFET trenches by plasma etching

InP Laser Manufacturing
Ensuring the facet is smooth and vertical

VCSEL Device Manufacturing
Low footing process for maximum device performance

ALD for GaN Power Devices
Fast, plasma-enhanced ALD enabling improved interfaces, high quality films and high throughput

Ion Beam Etching and Deposition
Laser Facet Processing by Ion Beam Sputtering

DR MARK DINEEN

Dr Mark Dineen has over 20 Years of plasma processing experience. His more recent work includes applying this knowledge to a wide range of devices from semiconductor lasers to GaN based RF devices.

Dr Dineen is now an Experienced Technical Marketing Manager with a demonstrated history of communicating complex technical ideas and scientific concepts to a varied audience. These technologies include ALD, ALE, CVD, ICP, PECVD and RIE plasma processing and cover how these can deliver device solutions to our customers.

DR LIGANG DENG

Principal Process Engineer, focussing on dry etch processes for III-V materials and Failure analysis as well as developing etch processes for other materials such as Cu, polymer, oxides and nitrides.

STEPHANIE BACLET

She works closely with optoelectronics device manufacturers to translate requirements
of their device characteristics into nanofabrication requirements for plasma processing products.

DR AILEEN O'MAHONY

Atomic Scale Processing Product Manager at Oxford Instruments. Aileen has worked in the US and UK on industry-driven process development for the commercialisation of ALD-functionalised products.

PAULINE ALVAREZ

Ion Beam Specialist at Oxford Instruments. Pauline is an experienced thin film processing expert with a specialisation in Ion Beam techniques for manufacturing of optoelectronic devices like lasers and IR sensors.