Hear the latest insights on low damage plasma etch & deposition solutions for device manufactuing
First class seat at a world class venue with the best-in-class compound semiconductor experts
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Atomic Layer Etching
A new technique for ultra precise and low damage etching
SiC Power Devices
Achieving smooth, low defect density substrates and optimum UMOSFET trenches by plasma etching
InP Laser Manufacturing
Ensuring the facet is smooth and vertical
VCSEL Device Manufacturing
Low footing process for maximum device performance
ALD for GaN Power Devices
Fast, plasma-enhanced ALD enabling improved interfaces, high quality films and high throughput
Ion Beam Etching and Deposition
Laser Facet Processing by Ion Beam Sputtering
Experienced Technical Marketing Manager with a demonstrated history of communicating complex technical ideas and scientific concepts to a varied audience for etch and deposition. These include ALD, ALE, CVD, ICP, PECVD and RIE.
Principal Process Engineer, focussing on dry etch processes for III-V materials and Failure analysis as well as developing etch processes for other materials such as Cu, polymer, oxides and nitrides.
She works closely with optoelectronics device manufacturers to translate requirements
of their device characteristics into nanofabrication requirements for plasma processing products.
Atomic Scale Processing Product Manager at Oxford Instruments. Aileen has worked in the US and UK on industry-driven process development for the commercialisation of ALD-functionalised products.
Ion Beam Specialist at Oxford Instruments. Pauline is an experienced thin film processing expert with a specialisation in Ion Beam techniques for manufacturing of optoelectronic devices like lasers and IR sensors.