CASSETTE TO CASSETTE SYSTEMS FOR HVM

Specifically designed to produce excellent uniformity and high rate films with a wide temperature range electrode. Compatible with wafers up to 200mm.

Designed to give total flexibility for Deep Silicon Etch (DSiE) across a wide range of applications. Estrelas offers smooth sidewall and high aspect ratio processes.

Fast, low damage, low CoO production plasma ALD processing for GaN power and RF devices. Atomfab is the fastest remote plasma production ALD system on the market.

Ion beam deposition and etching system with unmatched batch uniformity and the capability to be clustered with other plasma etch and deposition systems.

High-density plasma for fast etching and deposition rates. The process modules offer excellent uniformity, high-throughput, high-precision and low-damage processes for wafer sizes up to 200mm.

Delivering anisotropic dry etching for an extensive range of processes. Compatible with all wafer sizes up to 200mm with rapid change between wafers and low cost of ownership.

An evolution in single wafer etch technology. Polaris offers a smart ICP etching solution for harsh chemistries yields excellent uniformity.