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Atomfab is a revolutionary, high-performance PE-ALD system specifically designed for your production needs.

Atomic layer deposition (ALD) technology behind Atomfab offers precisely-controlled ultra-thin films for advanced applications on the nanometre scale, with conformal coating into high aspect ratio structures.

  • Sub-second cycle times
  • Excellent film uniformity and repeatability
  • Low substrate damage
  • Excellent maintenance with MTBF and MTTC
  • High material quality
  • Low particle counts
  • Clusterable with automated casette to casette wafer handling

Atomfab offers unique capability in engineering nanoscale structures and devices by combining remote and thermal plasma ALD processes. Download your free brochure below or contact one of our ALD experts for more information.

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UNIQUE HARDWARE CAPABILITY

Atomfab is designed for production from the ground-up, with powerful features and hardware as standard plus many options to upgrade specific parts of the system.

  • Loadlock with purged loading area
  • Compact remote plasma source up to 200°C
  • Excellent precursor and process control
  • 200mm wafer electrode up to 400°C, with option for RF biased and temperatures up to 600°C available
  • Optional Turbomolecular pump
  • Extensive process capability
  • Easy access to precursor cabinet, with glovepanel option available
  • On-board gas pod with 5 MFC controlled gases


Atomfab offers fast, high-quality process solutions with excellent cost of ownership for high-volume manufacturing.

 Pace

  • Six times faster than conventional remote plasma
  • Throughput at 7,000 200mm wafer per month (20nm ALD Al2O3 for single chamber)
  • Sub-second range throughput whilst offering ultra-low damage processing

 

Performance

  • High-quality plasma ALD films, with high breakdown voltage and uniformity
  • Reliability and repeatability with 10ms data logging of process parameters
  • Rear access to onboard gas pod, MFC and precursors for ease access servicing 

 Plasma

  • Patented remote source specifically designed for atomic scale processing
  • Low damage for sensitive substrates to maximise device performance
  • Fast cycle times and reliability thanks to uniform plasma exposure and short 80ms strike time
Low damage (remote) Short plasma exposure Short precursor & dose Conductive coatings
Small ICP Yes Medium Medium Yes
Direct CCP No Yes Yes Yes
Large ICP Yes Yes No No
Large ECR Yes No No No
Compact Remote Yes Yes Yes Yes

Revolutionary Plasma Source

Atomfab uses a patent pending remote source specifically designed for atomic scale processing.

  • Low damage for sensitive substrates for maximum device performance
  • Fast cycle times and reliablity with uniform plasma exposure and film deposition
  • Short plasma times (250ms) enabled by patent-pending AMU
  • Short strike time (80ms) for high throughput
  • Reproducible strike time and low reflected power for high yield
Atomfab RF power chart

Global Customer Support

Oxford Instruments is committed to providing a comprehensive, flexible and reliable global customer support. We offer excellent quality service throughout the life of your system.

  • Remote diagnostics software provides quick and easy fault diagnosis and resolution.
  • Support contracts are available to suit the budget and situation.
  • Global spares in strategic locations for quick response.
Find out more

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Contact Us Today For More Information