Silicon (Si)

Oxford Instruments Plasma Technology provides world-leading process solutions for working with Silicon (Si). From fast, deep, controlled etch to the finest nanostructures we have the plasma solution you need.

Si is the cornerstone of the semiconductor industry as well as providing the raw material for the majority of MEMS devices. Its properties and abundance has meant that it is ever present in modern technology.

Several solutions are available for etching Si and the choice depends very much on which device structure is required:

• Bosch process enables high etch rates, selectivity and anisotropy
• Cryogenic Deep Silicon Etch (Cryo-DSiE) is typically used for smooth sidewalls and/or nano-etching or tapered profiles in applications such as micro moulds etc.
• Mixed processes are an option for shallow, low aspect fine features
• Deposition of high-quality a-Si is achieved using PECVD