Oxford Instruments Plasma Technology provides world-leading process solutions for working with Silicon (Si). From fast, deep, controlled etch to the finest nanostructures we have the plasma solution you need.
Si is the cornerstone of the semiconductor industry as well as providing the raw material for the majority of MEMS devices. Its properties and abundance has meant that it is ever present in modern technology.
Poly Si can use different chemistries using pure and diluted silane. High quality Poly Si over 2inch wafers.
Si may be dry etched using HBr based selective silicon etching with the Inductively Coupled Plasma (ICP) process technique.
Large process database on various process chemistries.
Competitive process results in a large number of applications from black Si formation to high aspect ratio features.
Cryogenic Si etch
Cryogenic Si etch
Ultra high selectivity cryo-silicon etch