Nickel

Oxford Instruments Plasma Technology is a leading supplier of innovative plasma processing solutions for Nickel, unlocking the maximum performance from your devices.

Nickel (Ni) is highly corrosion resistant and is used for electrical contacts in semiconductor devices. It can also be used as a hard mask for plasma etching. It may be deposited using Ion Beam Deposition (IBD) and it can be etched using Inductively Coupled Plasma (ICP), Reactive Ion Etching (RIE) or Ion Beam Etch (IBE). It etches cleanly and anisotropically with Oxford Instrument's optimised plasma solutions.

Nickel

Competitive etching rate with good control of redeposition.

Wafer size: up to 100mm
- Product: PlasmaPro 100

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Nickel ICP Etching

Competitive etching rate with good control of redeposition.

Wafer size: up to 200mm
- Product: PlasmaPro 100

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Nickel RIE Etching

Process expertise applied to control redeposition and produce good profile at competitive etching rate.

Wafer size: up to 200mm
- Product: Ionfab300

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Nickel IBE

Competitive process results.

Wafer size: up to 200mm
- Product: Ionfab300

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