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Part of the Oxford Instruments Group
Chromium (Cr) metal is commonly used to make photomasks for lithography it is also used as a hardmask for etching materials such as Silicon Dioxide. It can be etched using Inductively Coupled Plasma (ICP), Reactive Ion Etching (RIE) or Ion Beam Etch (IBE).
We achieve control of critical dimensions down to sub 100nm features using our portfolio of etching techniques. Processing with high precision and excellent uniformity enables our customers to design innovative optical elements.
Read more about Chromium dry processing in our AR White Paper.
Process demonstrates excellent control of CD with optimised profile.
70nm Fused Silica lines. 933nm deep Cr mask. Courtesy of Cornell Nanoscience facility
Process expertise applied to control redeposition and produce good profile at competitive etching rate.
Good control of profile demonstrated across wafer.
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