Plasma processes are important for emerging silicon-based micro electromechanical systems (MEMS), nano electromechanical systems (NEMS) and advanced packaging (AP) applications. Typically, every device has a customised process flow, but synergies can be found as most are produced using a 2.5D approach comprising sequential deposition, lithography and etch cycles.
Silicon etch is at the heart of the most MEMS and NEMS devices. In this webinar, we will discuss the merits of each Deep Silicon Etch technique, including Bosch, Cryogenic and Mixed Gas processes, and their application to emerging devices.
Plasma processes are critical in enabling reproducible dry deposition and etch steps during manufacturing. Increasingly plasma processes are being adopted in nanoimprint lithography and bonding process steps.
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High Exposed Area Etch: Pillar Array for Microfluidic filter
Dr. Zhong Ren received his Ph.D degree in photonics from the University of Bristol in 2008. After that he worked on compound semiconductor and high brightness LED; he is currently focused on silicon-based process development. He is a Principal Applications Engineer at Oxford Instruments, working on plasma etch processing for 15 years. He has published over 20 journal papers and UK patents, about devices and fabrication at semiconductor, optoelectronics, and MEMS areas.