High-rate biased ALD: Introducing the PlasmaPro ASP

In this webinar, we introduce our groundbreaking new Atomic Layer Deposition system, the PlasmaPro ASP.

Atomic Layer Deposition (ALD) offers precise thickness control, tunable film properties, and excellent conformality. Combining ALD with high speed and increased deposition rates enables new use cases in superconducting quantum devices.

PlasmaPro ASP uses a unique source design to enable deposition rates on order of 20-200 nm/hour without compromising on film quality or conformality. These high deposition rates allow faster process development, high throughput, and thicker films. We will introduce the system and highlight recent process results for dielectrics and superconducting nitride films.