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Platinum (Pt) is a highly conductive metal that is commonly used in electrical contacts to semiconductor devices. It can be etched using Inductively Coupled Plasma (ICP), Ion Beam Etching and Reactive Ion Etching (RIE). It may be deposited using Atomic Layer Deposition  (ALD) and Ion Beam Deposition (IBD).

Optimised etching rate with good selectivity to resist.

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Process achieves good etch rate available with photoresist mask.

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Pt etch with rotation and adjustable tilt. Process expertise applied to control redeposition and produce good profile at competitive etching rate. Competitive process results.

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Excellent material quality, also possible at low deposition temperature.

  • Wafer size: up to 200mm
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Competitive process results.

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