Part of the Oxford Instruments Group


Chromium (Cr) metal is commonly used to make photomasks for lithography it is also used as a hardmask for etching materials such as Silicon Dioxide.  It can be etched using Inductively Coupled Plasma (ICP), Reactive Ion Etching (RIE) or Ion Beam Etch (IBE).

Process demonstrates excellent control of CD with optimised profile.

More on ICP Request more information

70nm Fused Silica lines. 933nm deep Cr mask. Courtesy of Cornell Nanoscience facility

Process expertise applied to control redeposition and produce good profile at competitive etching rate.

  • Wafer size: up to 200mm
  • Product size:  Ionfab300
More on IBE Request more information

Good control of profile demonstrated across wafer.

More on RIE Request more information

Related Products