Part of the Oxford Instruments Group
Collapse
Webinar
Semiconductor Failure Analysis Solutions

21st June 2018, 16:00 BST

Register and View

Semiconductor failure analysis (FA) requires painstaking detective work to understand the source of failures so that they can be removed from volume production. This can include: understanding the chemistry of defects and why they formed; analysing the strain within a solder joint to pre-empt critical failures and mapping changes in dopant distribution through device lifetimes. This webinar will expand on how Oxford Instruments solutions can enable you to detect and help overcome these and other challenges currently faced during semiconductor device production including:

  • Sub 10 nanometer elemental characterisation of failures in bulk SRAM devices reducing the burden on TEM
  • Pre-emptive identification of solder joint failures using high speed structural analysis in the SEM
  • Optimised preparation of TEM lamellae using advanced lift-out techniques and elemental characterisation
  • Optimised high selectivity isotropic and anisotropic etches for nitride, oxide and polyimide removal
  • High rate, high selectivity metallisation etch using inductively coupled plasma processing

 

Missed this Webinar?

Meet the Presenters

Dr James Sagar
Dr James Sagar
Group Product Marketing Manager at Oxford Instruments
Dr Ligang Deng
Dr Ligang Deng
Principal Process Engineer at Oxford Instruments